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Excellent Gas-Filled Packaging Metalizing Substrate Film
  • Excellent Gas-Filled Packaging Metalizing Substrate Film
  • Excellent Gas-Filled Packaging Metalizing Substrate Film
  • Excellent Gas-Filled Packaging Metalizing Substrate Film
  • Excellent Gas-Filled Packaging Metalizing Substrate Film
  • Excellent Gas-Filled Packaging Metalizing Substrate Film
  • Excellent Gas-Filled Packaging Metalizing Substrate Film
  • Excellent Gas-Filled Packaging Metalizing Substrate Film
  • Excellent Gas-Filled Packaging Metalizing Substrate Film
  • Excellent Gas-Filled Packaging Metalizing Substrate Film
  • Excellent Gas-Filled Packaging Metalizing Substrate Film
  • Excellent Gas-Filled Packaging Metalizing Substrate Film

    This product belongs to a kind of metalizing substrate. In comparision with the general purpose MCPP metalizing substrate, the product possess outstanding advantage such as more excellent heat sealing strength, lower initiative sealing temperature , much broader sealing temperature range and so on. After vacuum aluminizing, it is laminated with BOPP, BOPA, BOPET and other materials for bag making, mainly used for some puffed food packaging, such as potato chips packaging, etc.

     

    Product characteristic:

    *Excellent aluminium bonding fastness

    *Lower sealing temperature, much broader heat sealing temperature range

    *Excellent heat sealing strength

    *Excellent gloss, transparency and stiffness


    Physical and Mechanical Properties
    Item NameStandard ValueTypical IndexTesting Standard
    Tensile Strength Mpa MD≥3562ASTM D638 
    TD≥2533
    Elongation at break %MD≥280624
    TD≥380866
    Haze %Thickness≤30μm≤5.0≤3.0ASTM   D1003
    30μm<Thickness<80μm≤8.0≤5.0
    Heat Sealing Temperature (Non-treatment   surface)Heat   Sealing Type≤145118(≥8N)
    Non-heat   Sealing Type>145

    Surface Tension dyn/cm Treatment   Surface≥38≥38ISO   8296
    Non-treatment   Surface<33
        Dynamic Friction CoefficientBetween   Non-treatment Surfaces
    0.65-0.75 ASTM D1984



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